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30mm长正装灯丝封装设计及光电热性能分析

时间:2020-10-14 21:44来源:毕业论文
通过使用PROE和FLOEFD软件对30mmLED灯丝进行建模和热模拟,模拟结果与灯丝实际热分布情况基本相符。并且最终发现使用陶瓷基板的灯丝要比玻璃基板的灯丝更加容易散热,具有更优的散热

摘要LED灯丝光源是当前国内外LED行业研究的热点,本文主要针对30mm正装LED灯丝光源展开研究。首先设计并分析了不同支架结构对LED灯丝的影响,从而得到最佳的支架结构。而后对灯丝光源的封装工艺进行了研究,包括固晶、焊线及点胶等,并分析了每道工艺应注意的问题及其对成品灯丝光源性能的影响。而后通过对灯丝光源采用不同的直流电源驱动,研究其光通量、光效、色坐标、色温及显色指数等光、色参数对电流的变化规律。当电路增大时,光通量会逐渐增加,等随着电流的不断增加,光通量的增幅会逐渐减小,导致光效逐渐减低。另外,色坐标、色温等参数也会随着电流的变化而变化。另外电流越大,灯丝温度越高,这会反过来影响灯丝的光电性能。最后通过使用PROE和FLOEFD软件对30mmLED灯丝进行建模和热模拟,模拟结果与灯丝实际热分布情况基本相符。并且最终发现使用陶瓷基板的灯丝要比玻璃基板的灯丝更加容易散热,具有更优的散热性。57964

毕业论文关键词: LED灯丝; 封装; 热模拟

Analysis of 30mm long dress filament package design and electric properties of light

Abstract

LED light source is a filament current hot spots in LED industry research, a study for this paper is loaded 30mm LED light source filament. First designed and analyzed the effects of different support structure for LED filament, to get the best support structure. Then on the packaging process filament light source were studied, including solid crystal, wire and glue, etc., and analyzes each process should pay attention to its impact on finished filament light source performance. Then through the filament light source with different DC power-driven, research its luminous flux, luminous efficiency, color coordinates, color temperature and color rendering index of light, color variation of parameters of current. When the circuit is increased, the flux will gradually increase, and so with the increasing current, flux growth will gradually decrease, resulting in luminous efficiency decreased gradually. In addition, the color coordinates, color temperature and other parameters will change as the current changes. Further current, the higher the filament temperature, which in turn affect the optical and electrical properties of the filament. Finally, through the use of PROE and FLOEFD software 30mmLED filament modeling and thermal simulation, the simulation results with the actual thermal filament distribution basically. And finally found a filament filament than the glass substrate, a ceramic substrate easier to heat, it has better heat dissipation.

Keywords: LED filament; Package; Thermal Simulation 

目 录

摘要 2

Abstract 2

第1章  绪 论 2

1.1课题背景 2

1.2 课题操作方式及步骤 2

1.3 课题的研究目的和意义 2

第2章 LED灯丝的封装工艺及特性 2

2.1 LED灯丝封装简介 2

2.1.1 LED灯丝的工作原理 2

2.1.2 LED灯丝的基本结构 2

2.2 LED正装灯丝的基本特性 2

2.2.1 LED正装灯丝的优劣性及发展状况 2

2.2.2  LED灯丝其他封装结构的优劣性及发展状况 2

2.3 LED灯丝封装的操作注意事项 2

2.3.1 固晶悍线流程 30mm长正装灯丝封装设计及光电热性能分析:http://www.lwfree.com/wuli/lunwen_62856.html

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